Actively transitioning from 3D-printed tough-PLA test frames into carbon-fibre composite flight hardware for the Sustaino-1 airframe.
A three-layer volumetric strategy that maximises payload density inside the 46mm cavity while keeping thermal, power and RF paths cleanly segregated.
┌──────────────────────────────────────────┐
│ ▲ CEILING PAYLOAD INSETS │
│ · OV7670 Visual CMOS Tracker │
│ · Nitinol SMA Antenna Loop │
│ · 5V Passive Audio Beacon │
├──────────────────────────────────────────┤
│ ◆ 45° DIAGONAL FLOATING BRAIN RAIL │
│ · Raspberry Pi Pico 2 (RP2350) │
│ · GY-521 MPU-6050 IMU │
│ · AHT20 + BMP280 Climate │
├──────────────────────────────────────────┤
│ ▼ BASE POWER LAYER │
│ · 3-Cell LiPo · Charge Controller │
│ · Solar Harvest Bus · 5V Rail │
└──────────────────────────────────────────┘
46mm inner cavity · 2mm walls